Electronic package

ABSTRACT

The present description concerns a package for an electronic device. The package including a plate and a lateral wall, separated by a layer made of a bonding material and at least one region made of a material configured to form in the region an opening between the inside and the outside of the package when the package is heated.

BACKGROUND Technical Field

The present description generally concerns electronic devices and moreparticularly packages, for example, packages comprising optoelectronicdevices, and their manufacturing methods.

Description of the Related Art

It is current to commercialize electronic components or electronicdevices located in a package. The package for example comprises asupport, forming the lower side of the package, an upper plate formingthe upper side of the package, and a wall forming the lateral sides ofthe package.

The package is generally fastened and electrically connected to anotherdevice. However, the package fastening step may cause damage to thepackage.

BRIEF SUMMARY

An embodiment overcomes all or part of the disadvantages of knownpackages.

An embodiment provides a package for an electronic device, the packagecomprising a plate and a lateral wall, separated by a layer of a bondingmaterial and at least one region made of a material configured to formin the region an opening between the inside and the outside of thepackage when the package is heated.

Another embodiment provides a method of manufacturing a package for anelectronic device, the package comprising a plate and a lateral wall,the method comprising the forming of a layer made of a bonding materialand at least one region, separating the plate and the wall, the regionbeing made of a material configured to form in the region an openingbetween the inside and the outside of the package when the package isheated.

According to an embodiment, the region is configured to form the openingwhen the package is heated to a temperature greater than 150° C.

According to an embodiment, the lateral wall is made of resin.

According to an embodiment, the plate is made of glass.

According to an embodiment, said region is located between the wall andthe plate.

According to an embodiment, the device located in the package is anoptoelectronic device, which in some embodiments is a camera.

According to an embodiment, the device and the wall rests on a support,the support comprising conductive elements coupling the device to solderelements located under the support.

According to an embodiment, the plate is the support.

According to an embodiment, the opening is configured to form during astep of soldering of the solder elements.

According to an embodiment, the package is configured to be tight beforethe solder step.

According to an embodiment, the package is cleaned or rinsed with aliquid before the solder step.

According to an embodiment, the method comprises the deposition of amold on the support and the injection of resin into the mold to form thewall.

According to an embodiment, the method comprises the forming of the wallseparately from the support and the bonding of the wall to the supportwith a bonding layer.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The foregoing features and advantages, as well as others, will bedescribed in detail in the following description of specific embodimentsgiven by way of illustration and not limitation with reference to theaccompanying drawings, in which:

FIG. 1A is a perspective view of an embodiment of a package comprisingan optoelectronic device;

FIG. 1B is a cross-section view of the embodiment of FIG. 1A;

FIG. 2A shows the result of a step of manufacturing the embodiment ofFIGS. 1A and 1B;

FIG. 2B shows the result of a step of manufacturing the embodiment ofFIGS. 1A and 1B;

FIG. 2C shows the result of a step of manufacturing the embodiment ofFIGS. 1A and 1B;

FIG. 2D shows the result of a step of manufacturing the embodiment ofFIGS. 1A and 1B;

FIG. 2E shows the result of a step of manufacturing the embodiment ofFIGS. 1A and 1B;

FIG. 3 shows a variant of the embodiment of FIGS. 1A and 1B;

FIG. 4 shows another variant of the embodiment of FIGS. 1A and 1B; and

FIG. 5 shows another variant of the embodiment of FIGS. 1A and 1B.

DETAILED DESCRIPTION

Like features have been designated by like references in the variousfigures. In particular, the structural and/or functional features thatare common among the various embodiments may have the same referencesand may dispose identical structural, dimensional and materialproperties.

For the sake of clarity, only the steps and elements that are useful foran understanding of the embodiments described herein have beenillustrated and described in detail. In particular, the applications ofthe device located in the package will not be detailed.

Unless indicated otherwise, when reference is made to two elementsconnected together, this signifies a direct connection without anyintermediate elements other than conductors, and when reference is madeto two elements coupled together, this signifies that these two elementscan be connected or they can be coupled via one or more other elements.

In the following disclosure, unless otherwise specified, when referenceis made to absolute positional qualifiers, such as the terms “front”,“back”, “top”, “bottom”, “left”, “right”, etc., or to relativepositional qualifiers, such as the terms “above”, “below”, “upper”,“lower”, etc., or to qualifiers of orientation, such as “horizontal”,“vertical”, etc., reference is made to the orientation shown in thefigures.

Unless specified otherwise, the expressions “around”, “approximately”,“substantially” and “in the order of” signify within 10%, and, in someembodiments, within 5%.

FIG. 1A is a perspective view of an embodiment of a package 10comprising an optoelectronic device 12. FIG. 1B is a cross-section viewof the embodiment of FIG. 1A in plane B of FIG. 1A. In alternativeembodiments, the optoelectronic device 12 may instead be replaced with adie, an electronic component, or some other type of electronic device.

In some embodiments, device 12 is an optoelectronic device. In someembodiments, device 12 is a device receiving or emitting lightradiations. In some embodiments, the device 12 is a device receiving oremitting light radtions via an upper surface 12 a. Device 12 is, forexample, an image sensor, which may be, for example, a video camera.

Package 10 comprises a support 14. Support 14 forms the lower surface orplate of the package. In some embodiments, device 12 rests on support14. Support 14 comprises conductive elements 16 enabling to electricallyconnect the upper surface of support 14 to the lower surface of support14. In some embodiments, support 14 is made of an insulating materialhaving the conductive elements located therein. For example, conductiveelements 16 are conductive tracks. For example support 14 compriseslevels of conductive tracks 16 electrically coupled to one another byconductive vias, not shown. In some embodiments, support 14 comprisesconductive tracks 16 a flush with the upper surface of support 14 andallowing electric connections with device 12, for example, by electricwires 17, not shown in FIG. 1A. Support 14 further comprises tracks 16b, or pads 16 b, flush with the lower surface of support 14.

Solder balls 18 are for example located on tracks 16 b. Package 10 maythus be soldered to another device, not shown, by solder balls 18. As avariant, solder balls 18 may be replaced with other metal elementsenabling to solder package 10 to the other device. Thus, a metal landgrid array (LGA) or a solder paste may be formed on the lower surface ofsupport 14, to replace balls 18. Electric connections may thus be formedbetween the device 12 located in package 10 and the other device viawires 17, tracks 16, and solder elements, for example, balls 18 orlands.

Package 10 further comprises a wall 20. Wall 20 is for example made ofplastic, of resin, of ceramic, or of an organic material. In someembodiments, wall 20 is made of resin. The wall may be referred to as alayer, which may be made, for example, of plastic, of resin (e.g.,molding compound or encapsulant), of ceramic, of an organic material, orsome other suitable type of material. Wall 20 forms the lateral contourof package 10. Wall 20 thus forms the lateral surfaces of package 10.Wall 20 rests on support 14. Wall 20 extends from package 10. Thus, wall20 extends on the periphery of the upper surface of support 14. Wall 20extends around device 12.

In some embodiments, wall 20 is separated from device 12 by a gap 24 a,for example, filled with air. The gap 24 a may be a portion of cavity24. Gap 24 a extends from wall 20 to sidewalls of device 12. In someembodiments, wall 20 is a continuous wall.

In some embodiments, wall 20 is at least as tall as device 12 based onthe orientation as shown in FIG. 1B. Thus, in some embodiments, theupper surface of wall 20 is located above device 12 based on theorientation as shown in FIG. 1B.

A plate 22 is bonded to wall 20. The plate 22 thus forms the uppersurface of package 10. Plate 22 includes a first surface 23 that facestowards the device 12, the support 14, and the wall 20. Package 10 thuscomprises support 14, wall 20, and plate 22. Support 14, wall 20, andplate 22 form an inner cavity 24 having device 12 located therein.Support 14, wall 20, and plate delimit inner cavity 24 in which device12 is located therein. In some embodiments, cavity 24 is filled withair, which surrounds device 12.

Plate 22 is rigid, that is, the shape of the plate 22 is not modifiedduring its placing on wall 20. In particular, plate 22 does not stretchin the cavity 24 of package 10. In particular, in some embodiments,plate 22 comprises planar upper and lower surfaces parallel to eachother. Thus, in some embodiments, plate 22 is not in contact with device12. In some embodiments, plate 22 is separated from device 12 by a gap24 b, which is in some embodiments filled with air. Gab 24 b being aportion of cavity 24, and gap 24 b extends from upper surface of device12 to lower surface 24 b of plate 22.

In some embodiments, plate 22 is made of a transparent material. Inparticular, if device 12 is an optoelectronic device, plate 22 is madeof a material transparent to the wavelengths emitted and/or received bydevice 12. For example, if device 12 is a video camera, plate 22 istransparent to visible wavelengths. In some embodiments, plate 22 ismade of glass.

Package 10 further comprises a bonding layer 26, bonding plate 22 towall 20. Package 10 further comprises a region 28 between plate 22 andwall 20. In some embodiments, layer 26 is a glue layer. Layer 26 restson top of and in contact with the upper surface of wall 20. Plate 22rests on top of and in contact with layer 26. Layer 26 extends on theupper surface of wall 20, continuously around cavity 24, except for thelocation of region 28. Thus, in some embodiments, layer 26 extends overthe entire upper surface of wall 20 except for the location of region28. In other words, layer 26 comprises an opening totally filled withthe material of region 28. Thus, region 28 and layer 26 form acontinuous ring surrounding cavity 24. Region 28 is thus in contact withlayer 26. The inner layer 24 of package 10, and thus device 12, is thustotally surrounded with package 10. Plate 22 is thus separated from wall20 by layer 26 or region 28.

Region 28 extends from the inner cavity 24 of package 10, that is, theinside of package 10, to the outside of package 10. Thus, region 28 isnot separated from the inner cavity 24 of package 10 and is notseparated from the outside of package 10. In particular, region 28 isnot separated from the inner cavity 24 of package 10 and from theoutside of package 10 by layer 26. The inner cavity 24 of package 10 isthus directly separated from the outside of package 10 by region 28.

Region 28 for example has a parallelepipedal shape. Region 28 forexample comprises:

a surface, which is in some embodiments a lateral surface, is in contactwith the inside of package 10. In some embodiments, the surface is incontact with the air contained in the inner cavity 24 of package 10;

a surface, which is in some embodiments a lateral surface, is in contactwith the outside of package 10. In some embodiments, the surface is incontact with the air located outside of package 10;

a surface, which is in some embodiments an upper surface, is in contactwith plate 22;

a surface, which is in some embodiments a lower surface, is in contactwith wall 20; and

two surfaces, which are in some embodiments lateral surfaces. In someembodiments, the two surfaces are opposite to each other, and are incontact with layer 26.

Package 10 thus comprises an assembly of plate 22 on an assemblycomprising wall 20 and support 14. In some embodiments, the plate 22 isseparated from wall 20 by two distinct materials, which are in someembodiments only two materials, that is, the material for bonding layer26 and the material of region 28.

Package 10 may be submitted, after its forming, for example, after thesteps described in relation with FIGS. 2A to 2E, to a cleaning orrinsing step. The cleaning or rinsing step is for example carried outwith a liquid, for example, with water. During this rinsing step,package 10 is tight, that is, the liquid dos not penetrate into theinner cavity 24 of package 10. In other words, the material of bondinglayer 26 and the material of region 28 are tight, that is, they are suchthat the bonding between plate 22 and wall 20 is tight. In other words,a seal is formed between the material of bonding layer 26, the materialof region 28, and the plate such that liquid does not penetrate into theinner cavity 24 of package 10. There thus is no opening between plate 22and wall 20 during this step.

After the cleaning or rinsing step, package 10 may be stored for a longtime, for example, for several days, or even several weeks, before beingfastened, for example, by balls 18 or by another solder element, toanother device. The fastening step corresponds to a step of soldering,for example, of balls 18, in other words to a step of melting of thesolder elements located on the lower surface of support 14, for example,balls 18, on the other device. Package 10 is thus heated up to atemperature, for example, greater than 150° C.

During the storage period, humidity may propagate in the inner cavity 24of package 10, for example, via support 14, or wall 20.

During the step of melting of the solder elements, for example, balls18, the humidity in the inner cavity 24 of package 10 turns into vaporand increases the pressure in the inner cavity 24 of package 10. Thematerial of region 28 is selected in such a way that region 28 degradesunder the pressure of the water vapor during this melting step and formsan opening. Region 28 thus forms an exhaust valve for package 10.

The melting temperature of the solder elements, for example balls 18,depends on the material of the solder elements, for example, balls 18.The solder elements are made of metal and in some embodiments have amelting temperature greater than 150° C., in some embodiments have amelting temperature greater than 200° C., and in some embodiments have amelting temperature greater than 250° C. Thus, the material of region 28is selected to form an opening between the outside of package 10 and theinner cavity 24 of package 10 at the melting temperature of the solderelements, that is, in some embodiments at a temperature greater than150° C., in some embodiments greater than 200° C., and in someembodiments greater than 250° C. The opening extends from the innercavity 24 to an external environment outside of package 10.

In some embodiments, region 28 is configured to form an opening when thepressure in the inner cavity 24 of package 10 reaches a value greaterthan 1 atmosphere. However, in some embodiments, the pressure in theinner cavity 24 of the package 10 reaches a value greater than 1.5atmosphere.

Region 28 thus forms a vent in package 10 during the step of melting ofthe solder elements. Region 28 thus enables to degas the inner cavity 24of package 10.

For example, the region is made of a material which is flexible,stretchable, and/or deformable in such a way that during the meltingstep, at least a portion of the surface of region 28 located closest tothe inner cavity 24 of package 10 displaces to end up outside of package10. For example, the region is made of a material flexible, stretchable,and/or deformable in such a way that during the melting step, an airbubble forms in region 28 and bursts outside of cavity 24. In someembodiments, material of region 28 remains after the forming of theopening.

For example, the material of region 28 has an adherence to the materialof plate 22, of layer 26, and/or of wall 20 such that, during the stepof melting of the solder elements, the pressure causes the separation ofregion 28 and of plate 22, of layer 26, and/or of wall 20, which enablesair to flow outside of package 10. In other words, the pressuregenerated during the melting step may cause the delamination of thematerial of region 28.

For example, the material of region 28 is a porous material, capable ofbeing crossed by air but not by water.

For example, the material of region 28 is a viscous material, forexample, a gel enabling, under the pressure generated during the meltingstep, to allow the passage of air. In some embodiments, the material ofregion 28 is a silicone. In some embodiments, the material of region 28is a silicone gel. The opening formed in region 28 may then close backafter the passage of air.

In some embodiments, the opening formed in region 28 is definitive. Inother words, material 28, in some embodiments, does not recover itsoriginal shape after the melting step. In other words, the opening ispermanent once formed.

It could have been chosen not to form a region 28. Bonding layer 26would then form a continuous ring surrounding the inner cavity 24 ofpackage 10 and making the cavity tight. During the storage period, thecavity 24 of package 10 might accumulate enough humidity for thepressure formed in cavity 24 during the melting of the solder elementsto damage package 10, in particular to damage wall 20, support 14, orplate 22. The generated damage would then be in unexpected locations andmight disadvantageously modify the structure of package 10.

FIGS. 2A to 2E show the result of steps, which are in some embodimentssuccessive, of an example of a method of manufacturing the embodiment ofFIGS. 1A and 1B. FIGS. 2A to 2E are cross-section views in the plane ofFIG. 1B. More particularly, FIGS. 2A to 2E show steps of forming ofthree packages 10, each comprising a device 12. More generally, themanufacturing steps described in relation with FIGS. 2A to 2E are, forexample, carried out from a plate 40 enabling to form a plurality ofpackages 10.

FIG. 2A shows the result of a step of manufacturing of the embodiment ofFIGS. 1A and 1B.

During this step, the support 14 of each package 10 is formed. Inparticular, tracks 16 are formed to form supports 14. In some embodimentthe tracks 16 are formed in an insulating material.

In other words, plate 40, in some embodiments, comprises a plurality ofsupports 14, is formed. FIG. 2A shows three supports 14, each surroundedwith dotted lines, in plate 40.

The tracks 16 of supports 14 will not be detailed in the followingdrawings.

FIG. 2B shows the result of a step of manufacturing the embodiment ofFIGS. 1A and 1B.

During this step, a mold 42 is placed on plate 40. Mold 42 is located incontact with the surface of plate 40 having the walls 20 of thedifferent packages 10 located thereon.

Mold 40 comprises cavities 44 at the locations of walls 20. Cavities 44are located on the side of plate 40. Certain cavities 44 may correspondto the walls 20 of a plurality of neighboring packages 10. Thus, FIG. 2Bshows cavities 44 a having dimensions substantially corresponding to twowalls 20 side by side. The two walls will be separated afterwards,during the individualization of packages 10.

Mold 42 further comprises openings, not shown, providing access tocavities 44 when the mold is in contact with plate 40. Moreparticularly, said openings, not shown, are openings intended to be usedto place the material of walls 20 in the cavities 44 of mold 42.

FIG. 2C shows the result of a step of manufacturing the embodiment ofFIGS. 1A and 1B.

During this step, the material of walls 20 is placed in cavities 44 bythe openings, not shown. For example, the material of walls 20 is aresin. The resin is for example heated to become liquid. The liquidresin is then sent into cavities 44 via openings, not shown. The resinis then cooled to take a solid state.

Devices 12 are then placed on plate 40. Each device 12 is placed to besurrounded with a wall 20.

More generally, this step comprises the forming of the various elementslocated in the inner cavity 24 of each package 10. This step thuscomprises, for example, the forming of electric wires, not shown,coupling a device 12 to tracks 16.

FIG. 2D shows the result of a step of manufacturing of the embodiment ofFIGS. 1A and 1B.

During this step, a bonding layer corresponding to the bonding layers 26of packages 10 is formed on walls 20, particularly on the upper surfaceof walls 20. The bonding layer is not located at the locations ofregions 28. The locations of regions 28 are thus kept empty.

During this step, the plates 22 of each package 10 are placed on thelayer 26 of the corresponding package 10. In some embodiments, layers 26have been placed in such a way that when plates 22 rest on layers 26,the material of layers 26 does not overflow into the locations ofregions 28.

Bonding layers 26 are then, for example, heated, for example, at atemperature in the range from 80° C. to 200° C. and/or placed under UV(Ultraviolet) light, to solidify the material of layers 26 and to bondplates 22 to walls 20.

In some embodiments, the only openings in the rings formed by layers 26are located at the locations of regions 28.

FIG. 2E shows the result of a step of manufacturing the embodiment ofFIGS. 1A and 1B.

During this step, the locations of regions 28 are filled with thematerial of regions 28.

During this step, packages 10 are individualized. In other words, plate40, walls 20 a, and layers 26 are cut to separate the different packages10. In other words, plate 40 is separated into a plurality of supports14, walls 20 a are separated into a plurality of walls 20, and layers 26are separated to form the layers 26 of the different packages 10.

In some embodiments, plates 22 are placed to be sufficiently separatedfrom one another to enable to individualize packages 10, in other wordsto enable to separate walls 20 a and supports 14 between plates 22.

During this step, balls 18 are bonded to tracks on the lower surface ofeach support 14. As a variant, balls 18 or, more generally the solderelements, may be formed later on, for example before the step ofsoldering package 10 to another device, for example, after the rinsingstep.

The filling of regions 28, the individualization of packages 10, and theplacing of balls 18 may be performed in a different order.

As a variant, the steps illustrated by FIGS. 2B and 2C may be replacedwith steps during which: a mesh network corresponding to the walls 20corresponding to the supports 14 of plate 40 is formed separately fromplate 40; and said mesh network is bonded to plate 40 by a bondinglayer, which is in some embodiments a glue layer. The bonding betweenwall 20 and support 14 is, in this embodiment, tight. The placing ofdevices 12 is performed as described in relation with FIG. 2C. The nextsteps are then for example carried out as described in relation withFIGS. 2D and 2E.

FIG. 3 shows a variant of the embodiment of FIGS. 1A and 1B. Moreparticularly, FIG. 3 is a cross-section view of a variant of theembodiment of FIGS. 1A and 1B. FIG. 3 comprises the elements of FIGS. 1Aand 1B, which will not be described again.

The embodiment of FIG. 3 differs from the embodiment of FIGS. 1A and 1Bin that region 28 is separated from layer 26 by portions 46.

Portions 46 extend from the upper surface of wall 20. Portions 46 extendall the way to plate 22. Portions 46 are thus in contact, by an uppersurface, with plate 22 and, by a lower surface, with wall 20. In someembodiments, each portion 46 extends from the outside of package 10 toinner cavity 24. In some embodiments, portions 46 are made of thematerial of wall 20. The portions 46 may be integral with the wall 20such that portions 46 and wall 20 are made of a continuous and unitarymaterial. The portions 46 may be extension or protrusions that extendoutward from lateral wall 20.

In the example of FIG. 3, package 10 comprises two portions 46 only.Each of the two portions is located between a lateral surface of region28 and layer 26. Region 28 is thus not in contact with layer 26. Theregion delimited by the two portions 46, plate 22, and by wall 20 istotally (e.g., entirely) filled with region 28. Region 28 is thus incontact with portions 46. Similarly, layer 26 is in contact withportions 46, and, in some embodiments, with all portions 46.

The method of manufacturing the embodiment of FIG. 3 differs from themethod described in relation with FIGS. 2A to 2E by the shape of mold42. Indeed, mold 42 in a method of manufacturing the embodiment of FIG.3 comprises cavities 44 having the shape of wall 20 and of portions 46.Portions 46 are thus formed during the forming of wall 20, by injectionof the material of wall 20 into cavities 44. Afterwards, layer 26 isdeposited all over the upper surface of wall 20 outside of the locationof region 28. In some embodiments, the thickness of layer 26 is selectedin such a way that the upper surface of layer 26, after the bonding ofplate 22, is substantially coplanar with the upper surfaces of portions46.

An advantage of the embodiment of FIG. 3 is that it is possible tobetter control the dimensions of region 28. Indeed, layer 26 cannotoverflow on the location of region 28, the material of layer 26 beingblocked by portions 46.

As shown in FIG. 3, wall 20 includes a second surface 43 and a thirdsurface 45 separated from each other by the portions 46. Layer 26 is onthe second surface 43 and region 28 of material is on the third surface45. Layer 26 includes a first dimension D1 that extends from the secondsurface 43 to plate 22, and region 28 of material includes a seconddimension D2 that extends from the third surface 45 to the plate 22. Inthis embodiment, the first dimension D1 is substantially equal to orequal to the second dimension D2. In some embodiments, the firstdimension D1 may be greater than the first dimension D2 such that thethird surface 45 is closer to plate 22 as compared to the second surface43.

FIG. 4 shows another variant of the embodiment of FIGS. 1A and 1B. Moreparticularly, FIG. 4 is a cross-section view of a variant of theembodiment of FIGS. 1A and 1B. FIG. 4 comprises the elements of FIGS. 1Aand 1B and the elements of FIG. 3, which will not be described again.

The embodiment of FIG. 4 differs from the embodiment of FIG. 3 in thatlayer 26 is separated into a plurality of portions 26′ by portions 48.

Portions 48 extend from the upper surface of wall 20. Portions 48 extendall the way to plate 22. Portions 48 are thus in contact, by an uppersurface, with plate 22, and by a lower portion with wall 20. Portions 48are made of the material of wall 20. In some embodiments, each portion48 extends from the outside of package 10 to inner cavity 24. As avariant, portions 48 may have a different shape. For example, portions48 may not extend from the outside of package 10 to inner cavity 24, butonly over a portion of the dimension, from the outside of package 10 toinner cavity 24. The portions 48 may be integral with the wall 20 suchthat portions 48 and wall 20 are made of a continuous and unitarymaterial. The portions 48 may be extension or protrusions that extendoutward from lateral wall 20.

In the embodiment of FIG. 4, package 10 comprises three portions 48.Each portion 48 is located on a side of package 10. More particularly,in the embodiment of FIG. 4, layer 26 comprises four portionssubstantially rectangular in top view, each portion being separated, forexample, substantially in the middle, by a portion 48 or by portions 46and region 28. In other words, layer 26 comprises four portions, locatedon the angles of the upper surface of wall 20, each portion beingseparated from the neighboring portion by a portion 48 or by portions 46and region 48.

More generally, package 10 may comprise at least one portion 48,preferably located opposite region 46, to keep plate 22 horizontal.Preferably, package 10 comprises at least two portions 48. Preferably,the at least two portions 48 are located on different sides of package10 to hold plate 22.

Plate 22 is preferably separated from wall 20 by two distinct materials,preferably two materials only, other than the materials of wall 20, thatis, the bonding material of layer 26 and the material of region 28.

As a variant, at least one of portions 48 may be replaced with a region28. Said region 28 may for example be surrounded with portions 46.

FIG. 5 shows another variant of the embodiment of FIGS. 1A and 1B. Theembodiment of FIG. 5 comprises a package 50 which differs from thepackage 10 of FIGS. 1A and 1B in that wall 20 is bonded to support 14 bya bonding layer 52 and that region 28 is located between wall 20 andsupport 14.

As the package 10 of FIGS. 1A and 1B, package 50 comprises support 14,the solder elements, for example, balls 18, wall 20, and plate 22.

Plate 22 is bonded to wall 20 by layer 26. Layer 26 totally surroundsthe inner cavity 24 of package 50. Thus, the upper surface of wall 20is, in some embodiments, totally covered to bond plate 22 to wall 20.Plate 22 is thus separated from wall 20 by a single material, thebonding material. The bonding between wall 20 and plate 22 is thentight. In other words, the bonding between wall 20 and plate 22, in someembodiments, does not allow the passage of liquid.

Wall 20 is, in this embodiment, formed separately from support 14, asdescribed as a variant of the manufacturing method of FIGS. 2A to 2E.Wall 20 is thus bonded to support 14 by bonding layer 52.

Region 28 is, in this embodiment, located between wall 20 and support14, in the same way as region 28 is located between plate 22 and wall 20in the embodiment of FIGS. 1A and 1B. Wall 20 and support 14 are thusseparated by layer 52 and region 28.

The method of manufacturing package 50 for example comprises:

the forming of support 14, for example, the forming of a plurality ofsupports 14 in a same plate;

the forming of a mesh network of walls 20 separated from supports 14, aspreviously described;

the deposition of layers 52 and of the material of regions 28 onsupports 14;

the placing of the mesh network on supports 14 and its bonding, forexample, by heating;

the placing of the elements contained in the packages;

the forming of insulating layer 26; and

the individualization of packages 50.

As a variant, the forming of region 28 may be performed after theindividualization of packages 50.

An advantage of the described embodiments is that they avoid damage towall 20, to support 14, and to plate 22 during the melting of balls 18.

Another advantage of the described embodiments is that the package istight during the cleaning or rinsing step.

Another advantage of the described embodiments is that the packagecomprises, in a way, an air vent valve during the step of melting ofballs 18.

Various embodiments and variants have been described. Those skilled inthe art will understand that certain features of these variousembodiments and variants may be combined, and other variants will occurto those skilled in the art.

Finally, the practical implementation of the described embodiments andvariations is within the abilities of those skilled in the art based onthe functional indications given hereabove.

Package (10) for an electronic device (12), the package may besummarized as including a plate (14, 22) and a lateral wall (20),separated by a layer made of a bonding material and at least one region(28) made of a material configured to form in the region (28) an openingbetween the inside and the outside of the package when the package isheated.

Method of manufacturing a package (10) for an electronic device (12),the package may include a plate (14, 22) and a lateral wall (20), themethod may be summarized as including the forming of a layer made of abonding material and at least one region (28), separating the plate andthe wall, the region being made of a material configured to form in theregion (28) an opening between the inside and the outside of the packagewhen the package is heated.

The region (28) may be configured to form the opening when the package(10) is heated up to a temperature greater than 150° C.

The lateral wall (20) may be made of resin.

The plate (22) may be made of glass.

Said region (28) may be located between the wall (20) and the plate(22).

The device (12) located in the package (12) may be an optoelectronicdevice, and, in some embodiments, the optoelectronic device is a camera.

The device (12) and the wall (20) may rest on a support (14), thesupport including conductive elements (16) coupling the device (12) tosolder elements (18) located under the support (14).

The plate may be the support (14).

The opening may be configured to form during a step of soldering of thesolder elements (18).

The package (10) may be configured to be tight before the solder step.

The package (10) may be cleaned or rinsed with a liquid before thesolder step.

Method may include the deposition of a mold (42) on the support (14) andthe injection of resin into the mold to form the wall (20).

Method may include the forming of the wall (20) separately from thesupport (14) and the bonding of the wall to the support with a bondinglayer (52).

The various embodiments described above can be combined to providefurther embodiments. These and other changes can be made to theembodiments in light of the above-detailed description. In general, inthe following claims, the terms used should not be construed to limitthe claims to the specific embodiments disclosed in the specificationand the claims, but should be construed to include all possibleembodiments along with the full scope of equivalents to which suchclaims are entitled. Accordingly, the claims are not limited by thedisclosure.

1. A package, comprising: an electronic device within the package; aplate having a first surface overlapping the electronic device; alateral wall having a second surface facing the first surface; a layerof a bonding material extends from second surface of the lateral wall tofirst surface of the plate, the layer couples the plate to the lateralwall; and at least one region of a material configured to form in theregion an opening between an inside and an outside of the package whenthe package is heated, the at least one region of the material on thelateral wall and extends from the lateral wall to the first surface ofthe plate.
 2. The package according to claim 1, wherein the at least oneregion of the material is configured to form the opening when thepackage is heated up to a temperature greater than 150° C.
 3. Thepackage according to claim 1, wherein the lateral wall is made of resin.4. The package according to claim 1, wherein the plate is made of glass.5. The package according to claim 1, wherein the lateral wall furtherincludes a protrusion that extends from the lateral wall to the firstsurface of the plate, the protrusion separates the layer of bondingmaterial from the at least one region of material.
 6. The packageaccording to claim 1, wherein the electronic device is an optoelectronicdevice.
 7. The package according to claim 1, wherein the electronicdevice and the wall are coupled to a support, the support includingconductive elements electrically coupling the device to solder elementscoupled to the support.
 8. A method, comprising: forming a packageincluding: forming a layer of resin on a support; coupling a plate tothe layer of resin by forming a layer of bonding material on the layerof resin and depositing the plate on the layer of bonding material;forming of a layer made of a bonding material on the layer of resin;forming at least one region of a material having physical propertiesthat change when the package is heated; and forming an opening extendingfrom an inner cavity of the package to an external environment outsidethe package along the at least one region of the material by heating thepackage.
 9. The method according to claim 8, wherein heating the packageforming the opening includes forming solder elements on the support. 10.The method according to claim 9, wherein forming the layer of bondingmaterial and forming the at least one region of the material includesforming a seal between the layer of bonding material, the least oneregion of the material, and the plate preventing penetration of liquidinto the inner cavity of the package.
 11. The method according to claim10, further comprising cleaning or rinsing the package with a liquidbefore heating the package.
 12. The method according to claim 8, whereinforming the layer of resin includes positioning a mold on the supportand injecting a resin into the mold.
 13. The method according to claim8, wherein forming of the layer of resin includes forming a protrusionof the layer of resin.
 14. A device, comprising: a package including: asupport; a layer of resin on the support, the layer of resin including:a first surface; a second surface; and a first protrusion that extendsoutward from the layer of resin and separates the first surface from thesecond surface; a plate on the first protrusion of the layer of resin; alayer of a bonding material on the first surface couples the plate tothe layer of resin; an inner cavity delimited by the support, the layerof resin, the plate, and the layer of the bonding material; a layer of amaterial on the second surface separated from the layer of the bondingmaterial by the protrusion of the layer of resin, the layer of thematerial extends from the second surface of the layer of resin to theplate, the layer of the material configured to form an opening thatextends from the inner cavity to an external environment outside of thepackage when the package is heated.
 15. The device of claim 14, whereinthe layer of the material is configured to form the opening when thepackage is heated up to a temperature greater than 150° C.
 16. Thedevice of claim 14, wherein: the layer of the bonding material has afirst dimension extending from the first surface to the plate; the layerof the material has a second dimension extending from the second surfaceto the plate; and the first dimension is greater than the seconddimension.
 17. The device of claim 14, wherein the layer of resinincludes a second protrusion spaced apparat from the first protrusion,the second protrusion separates the layer of the material from the layerof the bonding material, and the layer of the material extends from thefirst protrusion to the second protrusion.
 18. The device of claim 17,wherein the layer of resin includes a third protrusion extending spacedapart from the first and second protrusions, respectively, the thirdprotrusion separating a first portion of the layer of bonding materialfrom a second portion of the layer of bonding material.
 19. The deviceof claim 18, wherein the third protrusion extends to the plate.